Educational
Complete guide to ordering PCB and SMD in Iran — from design to delivery
PCB fabrication and SMD assembly in Iran moves fastest when files, BOM data, and delivery expectations are clear from day one. This guide walks through the main steps from design to a finished board.
Design for manufacturing (DFM)
Before sending files, align trace width, minimum spacing, pad size, and solder mask resolution with real production capability. Small fixes at this stage usually prevent line stoppages later.
- Gerber and drill outputs with standard naming
- Panelization and edge-component clearance review
- Defined surface finish (HASL, ENIG, etc.)
Material and board type selection
Board thickness, FR-4 grade, layer count, and mask color directly affect cost and lead time. For industrial projects, material choice should match thermal and operating conditions.
- Layer count based on signal density
- Copper weight for current and heat
- Mask and silkscreen color coordination
SMD assembly process
After centroid and stencil approval, the line runs with an appropriate reflow profile. Visual inspection and basic testing before packing reduce delivery risk.
- Final BOM with approved alternates
- Pick-and-place file matched to Gerber revision
- Post-reflow review and delivery report