Troubleshooting
Troubleshooting reflow profiles and weak solder joints
A poor reflow profile can cause weak joints, tombstoning, or cracked solder. This guide covers early symptoms and first troubleshooting steps.
Common reflow symptoms
Inconsistent solder appearance on similar parts often indicates thermal imbalance.
- Dull or grainy joints
- Empty or half-populated pads
- Small part shifting
Thermal profile checks
The temperature curve must match paste and board requirements.
- Preheat timing
- Reflow peak verification
- Ramp and cool-down rates
Next steps
If the issue repeats, send a sample with the profile log for specialist review.
- Photos of affected pads
- Paste batch reference
- Comparison with a known-good board